This report contains market size and forecasts of Automatic Die Bonding System in global, including the following market information:
Global Automatic Die Bonding System Market Revenue, 2017-2022, 2023-2028, ($ millions)
Global Automatic Die Bonding System Market Sales, 2017-2022, 2023-2028, (Units)
Global top five Automatic Die Bonding System companies in 2021 (%)
The global Automatic Die Bonding System market was valued at million in 2021 and is projected to reach US$ million by 2028, at a CAGR of % during the forecast period.
The U.S. Market is Estimated at $ Million in 2021, While China is Forecast to Reach $ Million by 2028.
Fully Automatic Segment to Reach $ Million by 2028, with a % CAGR in next six years.
The global key manufacturers of Automatic Die Bonding System include Besi, ASM Pacific Technology (ASMPT), Kulicke & Soffa, Panasonic, Palomar Technologies, Shinkawa, DIAS Automation, Toray Engineering and InduBond, etc. In 2021, the global top five players have a share approximately % in terms of revenue.
MARKET MONITOR GLOBAL, INC (MMG) has surveyed the Automatic Die Bonding System manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Automatic Die Bonding System Market, by Type, 2017-2022, 2023-2028 ($ Millions) & (Units)
Global Automatic Die Bonding System Market Segment Percentages, by Type, 2021 (%)
Fully Automatic
Semi-Automatic
Global Automatic Die Bonding System Market, by Application, 2017-2022, 2023-2028 ($ Millions) & (Units)
Global Automatic Die Bonding System Market Segment Percentages, by Application, 2021 (%)
Chip Packaging and Testing
Integrated Device
Global Automatic Die Bonding System Market, By Region and Country, 2017-2022, 2023-2028 ($ Millions) & (Units)
Global Automatic Die Bonding System Market Segment Percentages, By Region and Country, 2021 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Automatic Die Bonding System revenues in global market, 2017-2022 (Estimated), ($ millions)
Key companies Automatic Die Bonding System revenues share in global market, 2021 (%)
Key companies Automatic Die Bonding System sales in global market, 2017-2022 (Estimated), (Units)
Key companies Automatic Die Bonding System sales share in global market, 2021 (%)
Further, the report presents profiles of competitors in the market, key players include:
Besi
ASM Pacific Technology (ASMPT)
Kulicke & Soffa
Panasonic
Palomar Technologies
Shinkawa
DIAS Automation
Toray Engineering
InduBond
FASFORD TECHNOLOGY
West-Bond
MRSI System