As the global economy mends, the 2021 growth of IC Packaging Substrate (SUB) will have significant change from previous year. According to our (LP Information) latest study, the global IC Packaging Substrate (SUB) market size is USD million in 2022 from USD million in 2021, with a change of % between 2021 and 2022. The global IC Packaging Substrate (SUB) market size will reach USD million in 2028, growing at a CAGR of % over the analysis period 2022-2028.
The United States IC Packaging Substrate (SUB) market is expected at value of US$ million in 2021 and grow at approximately % CAGR during forecast period 2022-2028. China constitutes a % market for the global IC Packaging Substrate (SUB) market, reaching US$ million by the year 2028. As for the Europe IC Packaging Substrate (SUB) landscape, Germany is projected to reach US$ million by 2028 trailing a CAGR of % over the forecast period 2022-2028. In APAC, the growth rates of other notable markets (Japan and South Korea) are projected to be at % and % respectively for the next 6-year period.
Global main IC Packaging Substrate (SUB) players cover Samsung Electro-Mechanics, MST, NGK, and KLA Corporation, etc. In terms of revenue, the global largest two companies occupy a share nearly % in 2021.
This report presents a comprehensive overview, market shares, and growth opportunities of IC Packaging Substrate (SUB) market by product type, application, key manufacturers and key regions and countries.
Segmentation by type: breakdown data from 2017 to 2022, in Section 2.3; and forecast to 2028 in section 12.6
Organic Substrate
Inorganic Substrate
Composite Substrate
Segmentation by application: breakdown data from 2017 to 2022, in Section 2.4; and forecast to 2028 in section 12.7.
Smart Phones
PC (Tablet, Laptop)
Wearable Devices
Others
This report also splits the market by region: Breakdown data in Chapter 4, 5, 6, 7 and 8.
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The report also presents the market competition landscape and a corresponding detailed analysis of the prominent manufacturers in this market, include
Samsung Electro-Mechanics
MST
NGK
KLA Corporation
Panasonic
Simmtech
Daeduck
ASE Material
Kyocera
Ibiden
Shinko Electric Industries
AT&S
LG InnoTek
Fastprint Circuit Tech
ACCESS
Danbond Technology
TTM Technologies
Unimicron
Nan Ya PCB
Kinsus
SCC