As the global economy mends, the 2021 growth of Wafer Packaging Materials will have significant change from previous year. According to our (LP Information) latest study, the global Wafer Packaging Materials market size is USD million in 2022 from USD million in 2021, with a change of % between 2021 and 2022. The global Wafer Packaging Materials market size will reach USD million in 2028, growing at a CAGR of % over the analysis period 2022-2028.
The United States Wafer Packaging Materials market is expected at value of US$ million in 2021 and grow at approximately % CAGR during forecast period 2022-2028. China constitutes a % market for the global Wafer Packaging Materials market, reaching US$ million by the year 2028. As for the Europe Wafer Packaging Materials landscape, Germany is projected to reach US$ million by 2028 trailing a CAGR of % over the forecast period 2022-2028. In APAC, the growth rates of other notable markets (Japan and South Korea) are projected to be at % and % respectively for the next 6-year period.
Global main Wafer Packaging Materials players cover Henkel, Shin-Etsu Chemical, Sumitomo Chemical Company, and KYOCERA, etc. In terms of revenue, the global largest two companies occupy a share nearly % in 2021.
This report presents a comprehensive overview, market shares, and growth opportunities of Wafer Packaging Materials market by product type, application, key players and key regions and countries.
Segmentation by type: breakdown data from 2017 to 2022 in Section 2.3; and forecast to 2028 in section 10.7.
Lead Frame
Package Substrate
Ceramic Packaging Materials
Bonding Wires
Packaging Material
Die Bonding Materials
Segmentation by application: breakdown data from 2017 to 2022, in Section 2.4; and forecast to 2028 in section 10.8.
Consumer Electronics
Automobile Industry
Others
This report also splits the market by region: Breakdown data in Chapter 4, 5, 6, 7 and 8.
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The report also presents the market competition landscape and a corresponding detailed analysis of the major players in the market. The key players covered in this report: Breakdown data in in Chapter 3.
Henkel
Shin-Etsu Chemical
Sumitomo Chemical Company
KYOCERA
Hitach Chemical
BASF SE
DuPont
Dow Corning
Alent
IBIDEN
SEMCO
MITSUI HIGH-TEC
Heraeus
Guangdong Wabon Technology
ETERNAL MATERIALS
Ningbo Kangqiang Electronics
Shennan Circuits
Zhuhai Advanced Chip Carriers&Electronic Substrate Solutions Technologies
Hebei Sinopack Electronic Technology
Beijing Doublink Solders
Jiangsu Hhck Advanced Materials
Hysol Huawei Electronics