The IC front-end laser annealing equipment uses a semiconductor laser as the annealing light source, and the product is easy to maintain; it adopts a temperature closed-loop control to monitor the temperature of the laser on the wafer surface in real time; it adopts a dual optical path coupling and temperature field compensation scheme to eliminate the wafer surface pattern The effect of density differences on spot energy absorption.
This report contains market size and forecasts of IC Front-end Laser Annealing Equipment in global, including the following market information:
Global IC Front-end Laser Annealing Equipment Market Revenue, 2017-2022, 2023-2028, ($ millions)
Global IC Front-end Laser Annealing Equipment Market Sales, 2017-2022, 2023-2028, (Units)
Global top five IC Front-end Laser Annealing Equipment companies in 2021 (%)
The global IC Front-end Laser Annealing Equipment market was valued at million in 2021 and is projected to reach US$ million by 2028, at a CAGR of % during the forecast period 2022-2028.
The U.S. Market is Estimated at $ Million in 2021, While China is Forecast to Reach $ Million by 2028.
14-28nm Segment to Reach $ Million by 2028, with a % CAGR in next six years.
The global key manufacturers of IC Front-end Laser Annealing Equipment include Veeco, Applied Materials, Japan Steel Works, SCREEN Semiconductor Solutions, Hitachi and Beijing U-PRECISION TECH, etc. In 2021, the global top five players have a share approximately % in terms of revenue.
MARKET MONITOR GLOBAL, INC (MMG) has surveyed the IC Front-end Laser Annealing Equipment manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global IC Front-end Laser Annealing Equipment Market, by Type, 2017-2022, 2023-2028 ($ Millions) & (Units)
Global IC Front-end Laser Annealing Equipment Market Segment Percentages, by Type, 2021 (%)
14-28nm
28-40nm
Others
Global IC Front-end Laser Annealing Equipment Market, by Application, 2017-2022, 2023-2028 ($ Millions) & (Units)
Global IC Front-end Laser Annealing Equipment Market Segment Percentages, by Application, 2021 (%)
Advanced Process Chip
Integrated Circuit
Others
Global IC Front-end Laser Annealing Equipment Market, By Region and Country, 2017-2022, 2023-2028 ($ Millions) & (Units)
Global IC Front-end Laser Annealing Equipment Market Segment Percentages, By Region and Country, 2021 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies IC Front-end Laser Annealing Equipment revenues in global market, 2017-2022 (Estimated), ($ millions)
Key companies IC Front-end Laser Annealing Equipment revenues share in global market, 2021 (%)
Key companies IC Front-end Laser Annealing Equipment sales in global market, 2017-2022 (Estimated), (Units)
Key companies IC Front-end Laser Annealing Equipment sales share in global market, 2021 (%)
Further, the report presents profiles of competitors in the market, key players include:
Veeco
Applied Materials
Japan Steel Works
SCREEN Semiconductor Solutions
Hitachi
Beijing U-PRECISION TECH